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Vol.29, No.12, 1304 ~ 1313, 1991
Title
A Study on Transient Liquid Phase Diffusion Bonding of 304 Stainless Steel
김우열Woo Yeol Kim, 강정윤Chung Yun Kang, 박세윤Se Yoon Park
Abstract
Change of microstructure in the bonded interlayer and tensile strength of joints were carried out during transient liquid phase diffusion bonding(TLP bonding) using SUS304 as base metal and SUS304+B alloy as insert metal. Main experimental results obtained in this study are as follows. 1) The optimum amount of B addition into the insert metal was found about 4wt%. 2) The completion time of isothermal solidification was 6.0ks and 3.8ks at the bonding tempetature of 1523K and 1553K respectively. With this bonding condition, microstructure in the bonded interlayer was same to that in the base metal because of the grain boundary magration in the bonded interlayer macroscopically. However, there exist fine car-borides and borides such as M_(23)(C, B)_6, Cr₂B and CrB at the grain boundary microscopically. These precipitates almost disappeared after homogenizing treatment at 1373K for 86. 4ks. 3) Exellent tensile properties of joints could be obtained by TLP bonding(1523K×6.0ks) using insert metal of base metal+4wt%B. Joint water-quenched at 1273K had higher tensile property than that of furnace-cooled joint. It is considered this is caused by the effect of retarding the precipitates at the grain boundary by water-quenching. Tensile properties of joints bonded under the vacuum and Ar atmosphere respectively were almost same.
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