발간논문

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Vol.19, No.9, 712 ~ 720, 1981
Title
A Study of the Microstructural Effect on the Contact Performance in Ag - Cu Electrical Contact Materials
문인형I . H . Moon, 정명상M . S . Chung, 김영입Y . L . Kim
Abstract
The relationship between the microstructures and some their related material properties was investigated in order to design the best suitable microstructure of the Ag-Cu electrical contact alloy. The Ag-Cu eutectic alloy was unidirectionally solidified in order to obtain an anisotropic microstructure. Some part of such unidirectionally solidified eutectic alloy has undergone also the rolling deformation to get the more elongated microstructure, characterizing the more anisotropic microstructural features. The specimen of a unidirectionally solidified eutectic structure has shown the better properties in regard to its application on electrical contact than the others. Furthermore its properties relevant to the contact performance was able to be improved by an appropriate rolling deformation. The specimen of the narrower lamellar spacing obtained by rolling deformation in direction to unidirectional solidification has shonw the best properties among the various types of the specimens investigated in this study. Possible explanation on the experimental result was also carried out.
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