| The texture and structure of the electrodeposit are associated with surface energies of deposit lattice planes and with cathode polarization. The copper deposit has the texture of {110} planes parallel to the deposit surface and the field oriented texture type structure, when sufficient copper ions exist near cathode as in the cases of the high bath temperature, agitated bath, high concentration solution and low current density. The deposit has the texture of [111] planes parallel to the deposit surface and the structure of growth lamellae parallel to surface, for the low ionic concentration adjacent to the cathode as in the cases of the low bath temperature, high current density, and low concentration solutions. The growth lamellar structure seems to be associated with stacking faults. For the electrolysis conditions between the above limited cases, textures different from [110] and [111] and structures different from the above ones can be obtained. |
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